OSAT Solution Show
Annual event3D/2.5D packaging · and equipment related to semiconductor post-processing (packaging materials · assembly equipment · etc.)
Key facts
- Attendance
- —
- Exhibitors
- —
- Floor space
- —
- Admission
- —
- Frequency
- Annual
- Editions
- 1 (2026)
OSAT Solution Show is an annual trade fair in Tokyo covering assembly equipment, general technologies and handling equipment. The most recent edition on record ran 10–12 June 2026 at Tokyo Big Sight; no future date has been announced. Organised by Japan Electronics Packaging and Circuits Association.
What is exhibited
- 3D/2.5D packaging
- and equipment related to semiconductor post-processing (packaging materials
- assembly equipment
- etc.)
- fan-out packaging (FO-WLP
- FO-PLP)
- General technologies
- handling equipment
- materials
- package design tools
- PLP
- simulators
- test systems
- wafer-level packaging
J-messe subject tags
JETRO's own classification, kept verbatim. Fairs carry several; the sector in the sidebar is the single one this site browses by.
Editions on record
Every dated instance of this fair the database holds. A series keeps one identity across renames and moves; each row below is one edition of it.
| Dates | Where | Visitors | Exhibitors |
|---|---|---|---|
| 10–12 Jun 2026 | Tokyo · Tokyo Big Sight | — | — |
Organizer
Japan Electronics Packaging and Circuits Association
Japan representative
Tel : +81-3-6675-6809
+81-3-6675-6809
[email protected]
Where this came from
Field-level provenance for the most recent edition: what each fact came from, how far it is trusted, and when it was last checked.
| Field | Source | Confidence | Verified |
|---|---|---|---|
| End date | jmesse archive | medium | 2025-12-26 |
| Start date | jmesse archive | medium | 2025-12-26 |
| Venue | jmesse archive | medium | 2025-12-26 |