Microelectronics Show

Key facts

Attendance 2025

49 760

Exhibitors

442

Floor space

—

Admission

—

Frequency

Annual

Editions

1 (2026)

Attendance and exhibitor figures for 2025 are the organizer's own and are not independently audited. They may include co-located or joint exhibitions.

Microelectronics Show is an annual trade fair in Tokyo covering COB system, component-embedded substrates and die bonders. The most recent edition on record ran 10–12 June 2026 at Tokyo Big Sight; no future date has been announced. The 2025 edition reported 49,760 visitors and 442 exhibitors, a figure published by the organiser and not independently audited. Organised by JIEP.

What is exhibited

• adhesives
• BGA/CSP assembly
• centered on cutting-edge future technologies / Sensors
• COB system
• component-embedded substrates
• die bonders
• dispenser
• display/optical devices
• etc.
• etc.)
• flip chip (FC) mounting
• heat countermeasure materials and materials
• High-density/high-frequency mounting technology applied products
• high-density mounting-related materials
• high-density substrates/interposers
• high-frequency compatible polymers
• LCD/ COG bonder
• lead-free solder/joining materials
• OLB/ILB system
• sealing resins
• semiconductor chips
• system-in-package (SiP)/system-on-chip (SoC)
• TAB mounting
• underfill materials
• various bonders (wire bonders
• various pastes

J-messe subject tags

JETRO's own classification, kept verbatim. Fairs carry several; the sector in the sidebar is the single one this site browses by.

• Testing & Measurement
• Manufacturing & Engineering
• Advanced Materials
• Electrical & Electronics

Editions on record

Every dated instance of this fair the database holds. A series keeps one identity across renames and moves; each row below is one edition of it.

Where this came from

Field-level provenance for the most recent edition: what each fact came from, how far it is trusted, and when it was last checked.